| Application | Widely used in optical glass, touch screen glass film, conductive glass, TFT-LCD, semiconductor electronics |
| Composition | Mo |
| Molding process | Sintering |
| Density | ≥9.7g/cm3 |
| Purity | 3N5 |
| Application | Widely used in optical glass, touch screen glass film, conductive glass, TFT-LCD, semiconductor electronics |
| Composition | AI |
| Molding process | Melting |
| Density | ≥2.7g/cm3 |
| Purity | 5N |
| Application | Widely used in space vehicles, Airbus A320, transportation equipment, sports equipment |
| Composition | ScAl |
| Molding process | Melting |
| Density | ≥99% |
| Purity | 4N |
| Application | Widely used in all kinds of decorative film, building automotive glass film, lithography film |
| Composition | Cr |
| Molding process | Sintering |
| Density | ≥7.15g/cm3 |
| Purity | 2N5-4N |
| Application | Widely used in optical glass, touch screen, semiconductor |
| Composition | Nb |
| Molding process | Melting |
| Density | ≥8.5g/cm |
| Purity | 3N |
| Application | Widely used in Low-E glass film system, optical glass, touch screen glass film system, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | Nb2Ox |
| Molding process | Sintering |
| Density | ≥4.5g/cm3 |
| Purity | 4N |
| Application | system, optical glass, touch screen glass film system, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | Si |
| Molding process | Growing |
| Density | ≥2.33g/cm3 |
| Purity | 5N |
| Application | Widely used in Low-E glass film system, optical glass, touch screen glass film system, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | SiO2 |
| Molding process | Melting |
| Density | ≥80% |
| Purity | 4N |
| Application | Widely used in Low-E glass film system, optical glass, touch screen glass film system, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | SnO2 |
| Molding process | Sintering |
| Density | ≥80% |
| Purity | 4N |
| Application | Widely used in Low-E glass film system, optical glass, touch screen glass film system, TFT-LCD, semiconductor electronics. |
| Composition | AZO |
| Molding process | Sintering |
| Density | ≥5.5g/cm3 |
| Purity | 3N5 |
| Application | Widely used in bathroom hardware, construction hardware, automotive hardware, chassis, decorative accessories, with high hardness, high brightness, anti-oxidation, no falling off, no fading. |
| Composition | Zr |
| Molding process | Melting |
| Density | ≥6.5g/cm3 |
| Purity | 3N |
| Application | Widely used in optical lenses, optical lenses |
| Composition | SiO2 |
| Molding process | Melting |
| Density | ≥2.2g/cm3 |
| Purity | 4N |
| Application | Widely used in optical glass, touch screen glass film, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | Mo |
| Molding process | Sintering |
| Density | ≥9.7g/cm3 |
| Purity | 3N5 |
| Application | Widely used in optical glass, touch screen glass film, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | AI |
| Molding process | Extrusion |
| Density | ≥2.7g/cm3 |
| Purity | 5N |
| Application | Widely used in Low-E glass film, touch screen glass film, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | Nb2Ox |
| Molding process | Spraying |
| Density | ≥4.3g/cm3% |
| Purity | 3N5 |
| Application | Widely used in SiO2 film, touch screen glass film, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | Si |
| Molding process | Spraying |
| Density | ≥2.23g/cm3 |
| Purity | 3N5 |
| Application | Widely used in decorative glass, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | Cu |
| Molding process | Melting |
| Density | ≥8.9g/cm3 |
| Purity | 4N |
| Application | Widely used in Optical glass, conductive glass, TFT-LCD, semiconductor electronics. |
| Composition | TiOx |
| Molding process | Spraying |
| Density | ≥4.1g/cm3 |
| Purity | 2N7 |
| Application | Widely used in Low-E glass film, optical glass, touch screen glass film system, TFT-LCD, semiconductor electronics |
| Composition | SiO2 |
| Molding process | Melting |
| Density | ≥2.2g/cm3 |
| Purity | 4N |
With advanced target and backplane metallization and bonding technology,
Zhongli can provide customers with binding services to help customers achieve optimal sputtering results.
No initial tack, hot melt + UV cure for easy foaming and rework.
